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Optoelectronic GTMS Seals
The term“hybrid package”or“microelectronic package”refers to the hermetically sealed packaging of encapsulated and non-encapsulated components in one container.
Key words:
middot
packaging
components
Classification:
Optoelectronic GTMS Seals
Hotline:
Optoelectronic GTMS Seals
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Product Description
The term“hybrid package”or“microelectronic package”refers to the hermetically sealed packaging of encapsulated and non-encapsulated components in one container.
Applications
·Data communication
·Microwave packaging
·Industrial lasers
·Medical technology
·Sensor technology
·Power electronics
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